Silicon wafer, mainly refers to monocrystalline silicon wafer, is the basic raw material for manufacturing IC. The wafer is manufactured by purified silicon (99.999%), and then the pure silicon is made into a long silicon ingot. After photolithography, grinding, polishing, slicing, and finally it turns to be a thin wafer which becomes the material of the semiconductor for manufacturing the integrated circuit.Silicon wafer has been widely applied for power IC, digital and analogue IC and memory chips.
Nova have years of experience in supplying high precision silicon wafer. Besides standard 6inch, 8 inch, 12 inch wafer, customized silicon wafer is also available for us. For other dimension, please feel free contact our sales engineer and we will be glad to discuss the availability of dimension options.
Technical Parameters of silicon wafer
Property | 4 inch | 5 inch | 6 inch | 8 inch |
Diameter | 100 ± 0.1 mm | 125 ± 0.1 mm | 150 ± 0.1 mm | 200 ± 0.1 mm |
Thickness | 500 ± 5 um or customized | 625 ± 5 um or customized | 675 ± 5 um or customized | 900 ± 5 um or customized |
Roughness | Ra ≤ 1 nm | Ra ≤ 1 nm | Ra ≤ 1 nm | Ra ≤ 1 nm |
Warp | ≤ 10um | ≤ 10um | ≤ 10um | ≤ 10um |
TTV | ≤ 3 um | ≤ 3 um | ≤ 3 um | ≤ 3 um |
Scratch/Dig | 20/10 | 20/10 | 20/10 | 20/10 |
Polish | DSP(Double Side Polished) | |||
Shape | Flat, Notch | |||
Bevel | C Shape | |||
Material | Silicon | |||
Orientation | <111>/<100>/<110> | |||
Dopant | P-type;N-type |