Due to its excellent transmission rate, low thermal expansion coefficient, strong shock resistance and excellent chemical stability, glass wafer has been widely applied for CMOS, CCD sensor MEMS, telecommunication and data processing, optical industry, electronic products, and high-tech product in military field and scientific research.
Nova have years of experience in supplying high precision glass wafer. Besides standard 4 inch ,5 inch，6 inch, 8 inch and12 inch wafer, customized glass wafer is also available for us.
Based upon customers’ demand, we offer glass wafer made from the following common substrate materials, including Sodalime, Pyrex, Borofloat, Borosilicate (D263T),Corning eagle XG, BK7 Etc. For other materials, please feel free contact our sales engineer and we will be glad to discuss the availability of material options.
Technical parameters of glass wafer
Property | 4 inch | 5 inch | 6 inch | 8 inch | 12 inch |
Diameter | 100 ± 0.1 mm | 125 ± 0.1 mm | 150 ± 0.1 mm | 200 ± 0.1 mm | 300± 0.1 mm |
Thickness | 500 ± 5 um or customized | 625 ± 5 um or customized | 675 ± 5 um or customized | 725 ± 5 um or customized | 900± 5 um or customized |
Roughness | Ra ≤ 1 nm | Ra ≤ 1 nm | Ra ≤ 1 nm | Ra ≤ 1 nm | Ra ≤ 1 nm |
Warp | ≤ 10um | ≤ 10um | ≤ 10um | ≤ 10um | ≤ 10um |
TTV | ≤ 3 um | ≤ 3 um | ≤ 3 um | ≤ 3 um | ≤ 3 um |
Scratch/Dig. | 20/10 | 20/10 | 20/10 | 20/10 | 20/10 |
Chipping | ≤ 0.2 mm | ≤ 0.2 mm | ≤ 0.2 mm | ≤ 0.2 mm | ≤ 0.2 mm |
Polish | DSP (Double Side Polished) | ||||
Shape | Round, Flat, Notch | ||||
Bevel | 45°bevel; SEMI spec bevel; C shape beval | ||||
Material | Sodalime, Pyrex, Borofloat, Borosilicate (D263T),Corning eagle XG, BK7, and etc. | ||||
Remarks | All specifications above can be customized upon your request | ||||
